10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP USA Inc. MPC8360VVAJDGA

NXP USA Inc. MPC8360VVAJDGA electronic component product image

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Manufacturer
Manufacturer No
MPC8360VVAJDGA
Date Code
19+
Quantity
2,800
Availability
In Stock
Package
740-LBGA
Packaging
Tray
Description
IC MPU MPC83XX 533MHZ 740TBGA
Detailed Description
PowerPC e300 Microprocessor IC MPC83xx 1 Core, 32-Bit 533MHz 740-TBGA (37.5x37.5)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
USB
USB 1.x (1)
SATA
-
Speed
533MHz
Series
MPC83xx
Ethernet
10/100/1000Mbps (1)
Packaging
Tray
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount
Voltage - I/O
1.8V, 2.5V, 3.3V
Core Processor
PowerPC e300
Package / Case
740-LBGA
RAM Controllers
DDR, DDR2
Co-Processors/DSP
Communications; QUICC Engine
Security Features
-
Base Product Number
MPC8360
Additional Interfaces
DUART, HDLC, I2C, PCI, SPI, UART
Graphics Acceleration
No
Operating Temperature
0°C ~ 105°C (TA)
Supplier Device Package
740-TBGA (37.5x37.5)
Number of Cores/Bus Width
1 Core, 32-Bit
Display & Interface Controllers
-
AttributeValue
USBUSB 1.x (1)
SATA-
Speed533MHz
SeriesMPC83xx
Ethernet10/100/1000Mbps (1)
PackagingTray
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount
Voltage - I/O1.8V, 2.5V, 3.3V
Core ProcessorPowerPC e300
Package / Case740-LBGA
RAM ControllersDDR, DDR2
Co-Processors/DSPCommunications; QUICC Engine
Security Features-
Base Product NumberMPC8360
Additional InterfacesDUART, HDLC, I2C, PCI, SPI, UART
Graphics AccelerationNo
Operating Temperature0°C ~ 105°C (TA)
Supplier Device Package740-TBGA (37.5x37.5)
Number of Cores/Bus Width1 Core, 32-Bit
Display & Interface Controllers-

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