X-Ray Inspection
X-ray scanning reveals hidden internal defects such as voids, cracked solder joints, or inconsistencies in BGA packaging. This non-destructive method allows internal verification without damaging the part.
Key Measures
- 2D and 3D X-ray imaging
- Solder and internal structure analysis
- Detection of hidden damage or tampering
Tools Used:
- X-ray inspection systems
- BGA analysis software
