NXP Semiconductors MPC8313CVRADDC
Image is only for reference
| Attribute | Value |
|---|---|
| CAN | 0 |
| HTS | 8542.31.00.50 |
| I2C | 2 |
| I2S | 0 |
| SPI | 1 |
| USB | 1 |
| PPAP | No |
| SVHC | Yes |
| UART | 2 |
| USART | 0 |
| EU RoHS | Compliant |
| Ethernet | 2 |
| Mounting | Surface Mount |
| ECCN (US) | 3A991a.2. |
| Packaging | Tray |
| Pin Count | 516 |
| Automotive | No |
| Lead Shape | Ball |
| Device Core | e300 |
| Family Name | PowerQUICC II Pro MPC83xx Processor |
| PCB changed | 516 |
| Availability | In Stock |
| Package Width | 24.3(Max) |
| Ethernet Speed | 10Mbps/100Mbps/1000Mbps |
| Interface Type | Ethernet/I2C/SPI/UART/USB |
| Package Height | 1.95(Max) |
| Package Length | 24.3(Max) |
| Data Cache Size | 16KB |
| I/O Voltage (V) | 1.8|2.5|3.3 |
| Supplier Package | TEBGA |
| Core Architecture | e300 |
| Maximum Speed (MHz) | 266 |
| Multiply Accumulate | No |
| Number of CPU Cores | 1 |
| Data Bus Width (bit) | 32 |
| Standard Package Name | BGA |
| Instruction Cache Size | 16KB |
| Manufacturer Lead Time | 99 weeks |
| Ethernet Interface Type | MII/RGMII/RMII/SGMII |
| Instruction Set Architecture | RISC |
| Maximum Power Dissipation (mW) | 1200 |
| Maximum Operating Temperature (°C) | 105 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 1.05 |
| Minimum Operating Supply Voltage (V) | 0.95 |
| Typical Operating Supply Voltage (V) | 1 |
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Packaging Process
