10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP Semiconductors MPC8309CVMAGDCA

NXP Semiconductors MPC8309CVMAGDCA electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
MPC8309CVMAGDCA
Date Code
24+
Quantity
8,820
Availability
In Stock
Package
MAP-BGA
Packaging
Tray
Description
MPU PowerQUICC II Pro MPC83xx Processor RISC 32bit 400MHz 1.8V/3.3V 489-Pin MAP-BGA Tray
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
CAN
4
HTS
8542.31.00.50
I2C
1
I2S
0
SPI
1
USB
1
PPAP
No
SVHC
Yes
UART
4
USART
0
EU RoHS
Compliant
Ethernet
0
Mounting
Surface Mount
ECCN (US)
3A991a.2.
Packaging
Tray
Pin Count
489
Automotive
No
Lead Shape
Ball
Device Core
e300
Family Name
PowerQUICC II Pro MPC83xx Processor
PCB changed
489
Availability
No Stock Available
Package Width
19
Ethernet Speed
10Mbps/100Mbps
Interface Type
CAN/I2C/SPI/UART/USB
On-Chip Memory
64KB/RAM
Package Height
1.27(Max)
Package Length
19
Data Cache Size
16KB
I/O Voltage (V)
3.3|1.8
Supplier Package
MAP-BGA
Maximum Speed (MHz)
400
Multiply Accumulate
No
Number of CPU Cores
1
Data Bus Width (bit)
32
Memory Card Interface
SD/SDIO/MMC
Standard Package Name
BGA
Instruction Cache Size
16KB
Instruction Set Architecture
RISC
Maximum Power Dissipation (mW)
969
Maximum Operating Temperature (°C)
105
Minimum Operating Temperature (°C)
-40
Maximum Operating Supply Voltage (V)
1.05
Minimum Operating Supply Voltage (V)
0.95
Typical Operating Supply Voltage (V)
1
AttributeValue
CAN4
HTS8542.31.00.50
I2C1
I2S0
SPI1
USB1
PPAPNo
SVHCYes
UART4
USART0
EU RoHSCompliant
Ethernet0
MountingSurface Mount
ECCN (US)3A991a.2.
PackagingTray
Pin Count489
AutomotiveNo
Lead ShapeBall
Device Coree300
Family NamePowerQUICC II Pro MPC83xx Processor
PCB changed489
AvailabilityNo Stock Available
Package Width19
Ethernet Speed10Mbps/100Mbps
Interface TypeCAN/I2C/SPI/UART/USB
On-Chip Memory64KB/RAM
Package Height1.27(Max)
Package Length19
Data Cache Size16KB
I/O Voltage (V)3.3|1.8
Supplier PackageMAP-BGA
Maximum Speed (MHz)400
Multiply AccumulateNo
Number of CPU Cores1
Data Bus Width (bit)32
Memory Card InterfaceSD/SDIO/MMC
Standard Package NameBGA
Instruction Cache Size16KB
Instruction Set ArchitectureRISC
Maximum Power Dissipation (mW)969
Maximum Operating Temperature (°C)105
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)1.05
Minimum Operating Supply Voltage (V)0.95
Typical Operating Supply Voltage (V)1

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Packaging Process