10-13 NOV 2026 · Munich, Germany

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NXP USA Inc. MPC8313CVRADDC

NXP USA Inc. MPC8313CVRADDC electronic component product image

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Manufacturer
Manufacturer No
MPC8313CVRADDC
Date Code
2403
Quantity
3,962
Availability
In Stock
Package
516-BBGA Exposed Pad
Packaging
Tray
Description
IC MPU MPC83XX 267MHZ 516TEPBGA
Detailed Description
PowerPC e300c3 Microprocessor IC MPC83xx 1 Core, 32-Bit 267MHz 516-TEPBGA (27x27)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
USB
USB 2.0 + PHY (1)
SATA
-
Speed
267MHz
Series
MPC83xx
Ethernet
10/100/1000Mbps (2)
Packaging
Tray
Manufacturer
NXP USA Inc.
Mounting Type
Surface Mount
Voltage - I/O
1.8V, 2.5V, 3.3V
Core Processor
PowerPC e300c3
Package / Case
516-BBGA Exposed Pad
RAM Controllers
DDR, DDR2
Co-Processors/DSP
-
Security Features
-
Base Product Number
MPC8313
Additional Interfaces
DUART, HSSI, I2C, PCI, SPI
Graphics Acceleration
No
Operating Temperature
-40°C ~ 105°C (TA)
Supplier Device Package
516-TEPBGA (27x27)
Number of Cores/Bus Width
1 Core, 32-Bit
Display & Interface Controllers
-
AttributeValue
USBUSB 2.0 + PHY (1)
SATA-
Speed267MHz
SeriesMPC83xx
Ethernet10/100/1000Mbps (2)
PackagingTray
ManufacturerNXP USA Inc.
Mounting TypeSurface Mount
Voltage - I/O1.8V, 2.5V, 3.3V
Core ProcessorPowerPC e300c3
Package / Case516-BBGA Exposed Pad
RAM ControllersDDR, DDR2
Co-Processors/DSP-
Security Features-
Base Product NumberMPC8313
Additional InterfacesDUART, HSSI, I2C, PCI, SPI
Graphics AccelerationNo
Operating Temperature-40°C ~ 105°C (TA)
Supplier Device Package516-TEPBGA (27x27)
Number of Cores/Bus Width1 Core, 32-Bit
Display & Interface Controllers-

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