Ultrasonic Scanning Microscope
High-frequency sound waves are used to scan internal chip layers. This process identifies delamination, cracks, and bonding failures invisible to the naked eye or X-ray.
Key Measures
- Internal layer integrity verification
- Detection of trapped air or microcracks
- Non-invasive acoustic analysis
Tools Used:
- Scanning acoustic microscope (SAM)
- Ultrasonic probes
