10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP Semiconductors LPC1850FET256,551

NXP Semiconductors LPC1850FET256,551 electronic component product image

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Manufacturer
Manufacturer No
LPC1850FET256,551
Date Code
22+
Quantity
450
Availability
In Stock
Package
LBGA
Packaging
Tray
Description
MCU 32-bit ARM Cortex M3 RISC 2.5V/3.3V 256-Pin LBGA Tray
Detailed Description
In order to make your CPU more versatile use this fantastic LPC1850FET256,551 microcontroller from NXP Semiconductors. This microcontroller has a minimum operating temperature of -40 °C and a maximum of 85 °C. It has a maximum clock speed of 150 MHz. This device is based on the ARM Cortex M3 core architecture. It has romless program memory. This is a 32 bit processor. Its ADC resolution is 10/10. This device has a typical operating supply voltage of 2.5|3.3 V. Its minimum operating supply voltage of 2.2 V, while its maximum is 3.6 V.
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
CAN
2
HTS
8542.31.00.25
I2C
2
I2S
2
PWM
1
SPI
3
USB
2
PPAP
No
SVHC
Yes
UART
1
USART
3
EU RoHS
Compliant
Ethernet
1
Mounting
Surface Mount
RAM Size
200KB
ECCN (US)
EAR99
Packaging
Tray
Pin Count
256
Automotive
No
Lead Shape
Ball
Device Core
ARM Cortex M3
Family Name
LPC1800
PCB changed
256
ADC Channels
8/8
Availability
In Stock
DAC Channels
1
No. of Timers
6
Package Width
17.2(Max)
Interface Type
CAN/I2C/I2S/Ethernet/SPI/UART/USART/USB
Number of ADCs
2
Number of DACs
1
Number of I/Os
164
Package Height
1.1(Max)
Package Length
17.2(Max)
Programmability
No
Special Features
CAN Controller
Supplier Package
LBGA
Core Architecture
ARM
ADC Resolution (bit)
10/10
DAC Resolution (bit)
10
Data Bus Width (bit)
32
Standard Package Name
BGA
Manufacturer Lead Time
16 weeks
Timers Resolution (bit)
32
Number of Watchdog Timers
1
Maximum CPU Frequency (MHz)
180
Instruction Set Architecture
RISC
Maximum Clock Frequency (MHz)
180
Maximum Power Dissipation (mW)
1500
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-40
Maximum Operating Supply Voltage (V)
3.6
Minimum Operating Supply Voltage (V)
2.2
Typical Operating Supply Voltage (V)
3.3|2.5
AttributeValue
CAN2
HTS8542.31.00.25
I2C2
I2S2
PWM1
SPI3
USB2
PPAPNo
SVHCYes
UART1
USART3
EU RoHSCompliant
Ethernet1
MountingSurface Mount
RAM Size200KB
ECCN (US)EAR99
PackagingTray
Pin Count256
AutomotiveNo
Lead ShapeBall
Device CoreARM Cortex M3
Family NameLPC1800
PCB changed256
ADC Channels8/8
AvailabilityIn Stock
DAC Channels1
No. of Timers6
Package Width17.2(Max)
Interface TypeCAN/I2C/I2S/Ethernet/SPI/UART/USART/USB
Number of ADCs2
Number of DACs1
Number of I/Os164
Package Height1.1(Max)
Package Length17.2(Max)
ProgrammabilityNo
Special FeaturesCAN Controller
Supplier PackageLBGA
Core ArchitectureARM
ADC Resolution (bit)10/10
DAC Resolution (bit)10
Data Bus Width (bit)32
Standard Package NameBGA
Manufacturer Lead Time16 weeks
Timers Resolution (bit)32
Number of Watchdog Timers1
Maximum CPU Frequency (MHz)180
Instruction Set ArchitectureRISC
Maximum Clock Frequency (MHz)180
Maximum Power Dissipation (mW)1500
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.2
Typical Operating Supply Voltage (V)3.3|2.5

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