NXP Semiconductors MC9S08SH8CTGR

NXP Semiconductors MC9S08SH8CTGR electronic component product image

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Manufacturer
Manufacturer No
MC9S08SH8CTGR
Quantity
48
Availability
In Stock
Package
16-TSSOP (0.173", 4.40mm Width)
Packaging
Bulk
Description
MC9S08SH - Microcontroller, 8-bi
Detailed Description
HCS08 S08 Microcontroller IC 8-Bit 40MHz 8KB (8K x 8) FLASH 16-TSSOP
Datasheet
Payment
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Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
NXP Semiconductors
Speed
40MHz
Series
S08
RAM Size
512 x 8
Core Size
8-Bit
Packaging
Bulk
EEPROM Size
-
Peripherals
LVD, POR, PWM, WDT
Connectivity
I2C, LINbus, SCI, SPI
Mounting Type
Surface Mount
Number of I/O
13
Core Processor
HCS08
Package / Case
16-TSSOP (0.173", 4.40mm Width)
Data Converters
A/D 8x10b
Oscillator Type
Internal
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
16-TSSOP
Voltage - Supply (Vcc/Vdd)
2.7V ~ 5.5V
AttributeValue
MfrNXP Semiconductors
Speed40MHz
SeriesS08
RAM Size512 x 8
Core Size8-Bit
PackagingBulk
EEPROM Size-
PeripheralsLVD, POR, PWM, WDT
ConnectivityI2C, LINbus, SCI, SPI
Mounting TypeSurface Mount
Number of I/O13
Core ProcessorHCS08
Package / Case16-TSSOP (0.173", 4.40mm Width)
Data ConvertersA/D 8x10b
Oscillator TypeInternal
Program Memory Size8KB (8K x 8)
Program Memory TypeFLASH
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package16-TSSOP
Voltage - Supply (Vcc/Vdd)2.7V ~ 5.5V

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping