NXP Semiconductors LPC824M201JDH20J

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Manufacturer
Manufacturer No
LPC824M201JDH20J
Quantity
325
Availability
In Stock
Package
20-TSSOP (0.173", 4.40mm Width)
Packaging
Bulk
Description
LPC824M201JDH20 - Low Cost 32-bi
Detailed Description
ARM® Cortex®-M0+ LPC82x Microcontroller IC 32-Bit 30MHz 32KB (32K x 8) FLASH 20-TSSOP
Payment
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Delivery
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AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
NXP Semiconductors
Speed
30MHz
Series
LPC82x
RAM Size
8K x 8
Core Size
32-Bit
Packaging
Bulk
EEPROM Size
-
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity
I2C, SPI, UART/USART
Mounting Type
Surface Mount
Number of I/O
16
Core Processor
ARM® Cortex®-M0+
Package / Case
20-TSSOP (0.173", 4.40mm Width)
Data Converters
A/D 5x12b SAR
Oscillator Type
Internal
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Operating Temperature
-40°C ~ 105°C (TA)
Supplier Device Package
20-TSSOP
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
AttributeValue
MfrNXP Semiconductors
Speed30MHz
SeriesLPC82x
RAM Size8K x 8
Core Size32-Bit
PackagingBulk
EEPROM Size-
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityI2C, SPI, UART/USART
Mounting TypeSurface Mount
Number of I/O16
Core ProcessorARM® Cortex®-M0+
Package / Case20-TSSOP (0.173", 4.40mm Width)
Data ConvertersA/D 5x12b SAR
Oscillator TypeInternal
Program Memory Size32KB (32K x 8)
Program Memory TypeFLASH
Operating Temperature-40°C ~ 105°C (TA)
Supplier Device Package20-TSSOP
Voltage - Supply (Vcc/Vdd)1.8V ~ 3.6V

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping