10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP Semiconductors LPC1830FET256K

NXP Semiconductors LPC1830FET256K electronic component product image

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Manufacturer
Manufacturer No
LPC1830FET256K
Date Code
22+
Quantity
808
Availability
In Stock
Package
LBGA
Packaging
Tray
Description
MCU 32-bit ARM Cortex M3 RISC 2.5V/3.3V 256-Pin LBGA Tray
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
CAN
2
HTS
8542.31.00.25
I2C
2
I2S
2
SPI
4
USB
2
PPAP
No
SVHC
Yes
UART
4
USART
3
EU RoHS
Compliant
Ethernet
1
Mounting
Surface Mount
RAM Size
200KB
ECCN (US)
3A991a.2.
Packaging
Tray
Pin Count
256
Automotive
No
Device Core
ARM Cortex M3
Family Name
LPC1800
PCB changed
256
ADC Channels
8/8
Availability
No Stock Available
No. of Timers
6
Package Width
17.2(Max)
Interface Type
CAN/I2C/I2S/Ethernet/SPI/UART/USART/USB
Number of ADCs
2
Number of DACs
1
Number of I/Os
164
Package Height
1.1(Max)
Package Length
17.2(Max)
Supplier Package
LBGA
Core Architecture
ARM
ADC Resolution (bit)
10/10
Data Bus Width (bit)
32
Standard Package Name
BGA
Manufacturer Lead Time
16 weeks
Timers Resolution (bit)
32
Maximum CPU Frequency (MHz)
150
Instruction Set Architecture
RISC
Maximum Clock Frequency (MHz)
150
Maximum Power Dissipation (mW)
1500
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-40
Maximum Operating Supply Voltage (V)
3.6
Minimum Operating Supply Voltage (V)
2.2
Typical Operating Supply Voltage (V)
2.5|3.3
AttributeValue
CAN2
HTS8542.31.00.25
I2C2
I2S2
SPI4
USB2
PPAPNo
SVHCYes
UART4
USART3
EU RoHSCompliant
Ethernet1
MountingSurface Mount
RAM Size200KB
ECCN (US)3A991a.2.
PackagingTray
Pin Count256
AutomotiveNo
Device CoreARM Cortex M3
Family NameLPC1800
PCB changed256
ADC Channels8/8
AvailabilityNo Stock Available
No. of Timers6
Package Width17.2(Max)
Interface TypeCAN/I2C/I2S/Ethernet/SPI/UART/USART/USB
Number of ADCs2
Number of DACs1
Number of I/Os164
Package Height1.1(Max)
Package Length17.2(Max)
Supplier PackageLBGA
Core ArchitectureARM
ADC Resolution (bit)10/10
Data Bus Width (bit)32
Standard Package NameBGA
Manufacturer Lead Time16 weeks
Timers Resolution (bit)32
Maximum CPU Frequency (MHz)150
Instruction Set ArchitectureRISC
Maximum Clock Frequency (MHz)150
Maximum Power Dissipation (mW)1500
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-40
Maximum Operating Supply Voltage (V)3.6
Minimum Operating Supply Voltage (V)2.2
Typical Operating Supply Voltage (V)2.5|3.3

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Packaging Process