10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP USA Inc. IP4302CX2/LF,315

NXP USA Inc. IP4302CX2/LF,315 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
IP4302CX2/LF,315
Package
2-XFBGA, WLCSP
Packaging
Tape & Reel (TR)
Description
TVS DIODE 2CSP
Detailed Description
Clamp Ipp Tvs Diode Surface Mount 2-CSP
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
NXP USA Inc.
Type
Zener
Series
-
Packaging
Tape & Reel (TR)
Applications
General Purpose
Mounting Type
Surface Mount
Package / Case
2-XFBGA, WLCSP
Power - Peak Pulse
-
Base Product Number
IP430
Operating Temperature
-35°C ~ 85°C (TA)
Power Line Protection
No
Bidirectional Channels
1
Capacitance @ Frequency
10pF @ 1MHz
Supplier Device Package
2-CSP
Voltage - Breakdown (Min)
14V
Voltage - Clamping (Max) @ Ipp
-
Voltage - Reverse Standoff (Typ)
-
Current - Peak Pulse (10/1000µs)
-
AttributeValue
MfrNXP USA Inc.
TypeZener
Series-
PackagingTape & Reel (TR)
ApplicationsGeneral Purpose
Mounting TypeSurface Mount
Package / Case2-XFBGA, WLCSP
Power - Peak Pulse-
Base Product NumberIP430
Operating Temperature-35°C ~ 85°C (TA)
Power Line ProtectionNo
Bidirectional Channels1
Capacitance @ Frequency10pF @ 1MHz
Supplier Device Package2-CSP
Voltage - Breakdown (Min)14V
Voltage - Clamping (Max) @ Ipp-
Voltage - Reverse Standoff (Typ)-
Current - Peak Pulse (10/1000µs)-

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Packaging Process