10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP Semiconductors IP4309CX9,135

NXP Semiconductors IP4309CX9,135 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
IP4309CX9,135
Package
WLCSP
Packaging
Tape and Reel
Description
ESD Suppressor Diode Diode Array Uni-Dir 5.5V 9-Pin WLCSP T/R
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
PPAP
No
Type
Diode Array
EU RoHS
Supplier Unconfirmed
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tape and Reel
Pin Count
9
Automotive
No
PCB changed
9
Availability
No Stock Available
Configuration
Octal
Package Width
1.16
Direction Type
Uni-Directional
Package Height
0.61
Package Length
1.16
Supplier Package
WLCSP
Standard Package Name
CSP
Capacitance Value (pF)
1.5
Maximum Working Voltage (V)
5.5
Number of Elements per Chip
8
Maximum Operating Temperature (°C)
85
Minimum Operating Temperature (°C)
-30
Maximum Reverse Leakage Current (uA)
0.05
AttributeValue
PPAPNo
TypeDiode Array
EU RoHSSupplier Unconfirmed
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count9
AutomotiveNo
PCB changed9
AvailabilityNo Stock Available
ConfigurationOctal
Package Width1.16
Direction TypeUni-Directional
Package Height0.61
Package Length1.16
Supplier PackageWLCSP
Standard Package NameCSP
Capacitance Value (pF)1.5
Maximum Working Voltage (V)5.5
Number of Elements per Chip8
Maximum Operating Temperature (°C)85
Minimum Operating Temperature (°C)-30
Maximum Reverse Leakage Current (uA)0.05

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Packaging Process