10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP Semiconductors SC100738CDWE

NXP Semiconductors SC100738CDWE electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
SC100738CDWE
Package
SOIC EIAJ
Packaging
Rail
Description
MCU 4KB Flash 8-Pin SOIC EIAJ Rail
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
CAN
0
HTS
8542.31.00.30
I2C
0
I2S
0
SPI
0
USB
0
PPAP
No
SVHC
Yes
UART
0
USART
0
EU RoHS
Compliant
Ethernet
0
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Rail
Pin Count
8
Automotive
No
Lead Shape
Gull-wing
PCB changed
8
Availability
No Stock Available
Package Width
5.45(Max)
Package Height
1.85(Max)
Package Length
5.5(Max)
Programmability
Yes
Supplier Package
SOIC EIAJ
Program Memory Size
4KB
Program Memory Type
Flash
Standard Package Name
SO
AttributeValue
CAN0
HTS8542.31.00.30
I2C0
I2S0
SPI0
USB0
PPAPNo
SVHCYes
UART0
USART0
EU RoHSCompliant
Ethernet0
MountingSurface Mount
ECCN (US)EAR99
PackagingRail
Pin Count8
AutomotiveNo
Lead ShapeGull-wing
PCB changed8
AvailabilityNo Stock Available
Package Width5.45(Max)
Package Height1.85(Max)
Package Length5.5(Max)
ProgrammabilityYes
Supplier PackageSOIC EIAJ
Program Memory Size4KB
Program Memory TypeFlash
Standard Package NameSO

Purchase & Inquiry

Placing an Order

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Payment Options

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RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process