NXP Semiconductors LPC5528JBD100K
Image is only for reference
| Attribute | Value |
|---|---|
| CAN | 0 |
| HTS | 8542.31.00.25 |
| I2C | 8 |
| I2S | 8 |
| SPI | 8 |
| USB | 2 |
| PPAP | No |
| SVHC | Yes |
| UART | 8 |
| USART | 8 |
| EU RoHS | Compliant |
| Ethernet | 0 |
| Mounting | Surface Mount |
| RAM Size | 256KB |
| ECCN (US) | 3A991a.2. |
| Packaging | Tray |
| Pin Count | 100 |
| Automotive | No |
| Device Core | ARM Cortex M33 |
| PCB changed | 100 |
| ADC Channels | 10 |
| Availability | In Stock |
| No. of Timers | 5 |
| Package Width | 14 |
| Interface Type | I2C/I2S/SPI/USART/USB |
| Number of ADCs | 1 |
| Number of I/Os | 64 |
| Package Height | 1.45(Max) |
| Package Length | 14 |
| Programmability | Yes |
| Supplier Package | HLQFP EP |
| Core Architecture | ARM |
| Process Technology | 40nm |
| Program Memory Size | 512KB |
| Program Memory Type | Flash |
| ADC Resolution (bit) | 16 |
| Data Bus Width (bit) | 32 |
| Standard Package Name | QFP |
| Manufacturer Lead Time | 16 weeks |
| Maximum CPU Frequency (MHz) | 150 |
| Instruction Set Architecture | RISC |
| Maximum Clock Frequency (MHz) | 150 |
| Maximum Operating Temperature (°C) | 105 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Supply Voltage (V) | 1.8 |
| Typical Operating Supply Voltage (V) | 3.3 |
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Packaging Process
