NXP Semiconductors LPC1224FBD64/121,1

NXP Semiconductors LPC1224FBD64/121,1 electronic component product image

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Manufacturer
Manufacturer No
LPC1224FBD64/121,1
Package
64-LQFP
Packaging
Bulk
Description
LPC1224 - Robust and Reliable 32
Detailed Description
ARM® Cortex®-M0 LPC1200 Microcontroller IC 32-Bit 45MHz 48KB (48K x 8) FLASH 64-LQFP (10x10)
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
NXP Semiconductors
Speed
45MHz
Series
LPC1200
RAM Size
4K x 8
Core Size
32-Bit
Packaging
Bulk
EEPROM Size
-
Peripherals
Brown-out Detect/Reset, DMA, POR, WDT
Connectivity
I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Mounting Type
Surface Mount
Number of I/O
55
Core Processor
ARM® Cortex®-M0
Package / Case
64-LQFP
Data Converters
A/D 8x10b SAR
Oscillator Type
Internal
Program Memory Size
48KB (48K x 8)
Program Memory Type
FLASH
Operating Temperature
-40°C ~ 85°C (TA)
Supplier Device Package
64-LQFP (10x10)
Voltage - Supply (Vcc/Vdd)
3V ~ 3.6V
AttributeValue
MfrNXP Semiconductors
Speed45MHz
SeriesLPC1200
RAM Size4K x 8
Core Size32-Bit
PackagingBulk
EEPROM Size-
PeripheralsBrown-out Detect/Reset, DMA, POR, WDT
ConnectivityI2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART
Mounting TypeSurface Mount
Number of I/O55
Core ProcessorARM® Cortex®-M0
Package / Case64-LQFP
Data ConvertersA/D 8x10b SAR
Oscillator TypeInternal
Program Memory Size48KB (48K x 8)
Program Memory TypeFLASH
Operating Temperature-40°C ~ 85°C (TA)
Supplier Device Package64-LQFP (10x10)
Voltage - Supply (Vcc/Vdd)3V ~ 3.6V

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping