10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Nexperia USA Inc. PMDPB95XNE2X

Nexperia USA Inc. PMDPB95XNE2X electronic component product image

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Manufacturer
Manufacturer No
PMDPB95XNE2X
Quantity
29
Availability
In Stock
Package
HUSON EP
Packaging
Tape and Reel
Description
Trans MOSFET N-CH 30V 2.7A 6-Pin HUSON EP T/R
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
EA
PPAP
No
SVHC
Yes
EU RoHS
Compliant
Category
Power MOSFET
Mounting
Surface Mount
ECCN (US)
EAR99
Packaging
Tape and Reel
Pin Count
6
Automotive
No
PCB changed
6
Availability
No Stock Available
Channel Mode
Enhancement
Channel Type
N
Configuration
Dual
Package Width
2.1(Max)
Package Height
0.61(Max)
Package Length
2.1(Max)
Supplier Package
HUSON EP
Maximum IDSS (uA)
1
Standard Package Name
SON
Typical Fall Time (ns)
8
Typical Rise Time (ns)
10
Number of Elements per Chip
2
Maximum Power Dissipation (mW)
1165
Typical Gate Charge @ Vgs (nC)
Maximum Gate-Source Voltage (V)
12
Typical Turn-On Delay Time (ns)
9
Maximum Drain-Source Voltage (V)
30
Typical Turn-Off Delay Time (ns)
20
Maximum Gate Threshold Voltage (V)
1.25
Maximum Operating Temperature (°C)
150
Minimum Operating Temperature (°C)
-55
Maximum Continuous Drain Current (A)
2.7
Typical Input Capacitance @ Vds (pF)
258@15V
Maximum Drain-Source Resistance (mOhm)
Maximum Gate-Source Leakage Current (nA)
10000
Typical Reverse Transfer Capacitance @ Vds (pF)
23@15V
AttributeValue
HTSEA
PPAPNo
SVHCYes
EU RoHSCompliant
CategoryPower MOSFET
MountingSurface Mount
ECCN (US)EAR99
PackagingTape and Reel
Pin Count6
AutomotiveNo
PCB changed6
AvailabilityNo Stock Available
Channel ModeEnhancement
Channel TypeN
ConfigurationDual
Package Width2.1(Max)
Package Height0.61(Max)
Package Length2.1(Max)
Supplier PackageHUSON EP
Maximum IDSS (uA)1
Standard Package NameSON
Typical Fall Time (ns)8
Typical Rise Time (ns)10
Number of Elements per Chip2
Maximum Power Dissipation (mW)1165
Typical Gate Charge @ Vgs (nC)[email protected]
Maximum Gate-Source Voltage (V)12
Typical Turn-On Delay Time (ns)9
Maximum Drain-Source Voltage (V)30
Typical Turn-Off Delay Time (ns)20
Maximum Gate Threshold Voltage (V)1.25
Maximum Operating Temperature (°C)150
Minimum Operating Temperature (°C)-55
Maximum Continuous Drain Current (A)2.7
Typical Input Capacitance @ Vds (pF)258@15V
Maximum Drain-Source Resistance (mOhm)[email protected]
Maximum Gate-Source Leakage Current (nA)10000
Typical Reverse Transfer Capacitance @ Vds (pF)23@15V

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Packaging Process