10-13 NOV 2026 · Munich, Germany

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Microchip Technology MSCSM70AM07CT3AG

Microchip Technology MSCSM70AM07CT3AG electronic component product image

Image is only for reference

Manufacturer No
MSCSM70AM07CT3AG
Availability
In Stock
Package
Module
Packaging
Tube
Description
MOSFET 2N-CH 700V 353A SP3F
Detailed Description
Mosfet Array 700V 353A (Tc) 988W (Tc) Chassis Mount SP3F
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
-
Packaging
Tube
Technology
Silicon Carbide (SiC)
FET Feature
-
Power - Max
988W (Tc)
Manufacturer
Microchip Technology
Configuration
2 N Channel (Phase Leg)
Mounting Type
Chassis Mount
Package / Case
Module
Vgs(th) (Max) @ Id
2.4V @ 12mA
Base Product Number
MSCSM70
Operating Temperature
-40°C ~ 175°C (TJ)
Rds On (Max) @ Id, Vgs
6.4mOhm @ 120A, 20V
Supplier Device Package
SP3F
Gate Charge (Qg) (Max) @ Vgs
645nC @ 20V
Drain to Source Voltage (Vdss)
700V
Input Capacitance (Ciss) (Max) @ Vds
13500pF @ 700V
Current - Continuous Drain (Id) @ 25°C
353A (Tc)
AttributeValue
Series-
PackagingTube
TechnologySilicon Carbide (SiC)
FET Feature-
Power - Max988W (Tc)
ManufacturerMicrochip Technology
Configuration2 N Channel (Phase Leg)
Mounting TypeChassis Mount
Package / CaseModule
Vgs(th) (Max) @ Id2.4V @ 12mA
Base Product NumberMSCSM70
Operating Temperature-40°C ~ 175°C (TJ)
Rds On (Max) @ Id, Vgs6.4mOhm @ 120A, 20V
Supplier Device PackageSP3F
Gate Charge (Qg) (Max) @ Vgs645nC @ 20V
Drain to Source Voltage (Vdss)700V
Input Capacitance (Ciss) (Max) @ Vds13500pF @ 700V
Current - Continuous Drain (Id) @ 25°C353A (Tc)

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