10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Microchip Technology MSCSM70AM025CT6AG

Microchip Technology MSCSM70AM025CT6AG electronic component product image

Image is only for reference

Manufacturer No
MSCSM70AM025CT6AG
Availability
In Stock
Package
Module
Packaging
Tube
Description
MOSFET 700V 538A SP6C
Detailed Description
Mosfet Array 700V 538A (Tc) Chassis Mount SP6C
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
-
Packaging
Tube
Technology
Silicon Carbide (SiC)
FET Feature
-
Power - Max
-
Manufacturer
Microchip Technology
Configuration
-
Mounting Type
Chassis Mount
Package / Case
Module
Vgs(th) (Max) @ Id
-
Base Product Number
MSCSM70
Operating Temperature
-
Rds On (Max) @ Id, Vgs
-
Supplier Device Package
SP6C
Gate Charge (Qg) (Max) @ Vgs
-
Drain to Source Voltage (Vdss)
700V
Input Capacitance (Ciss) (Max) @ Vds
-
Current - Continuous Drain (Id) @ 25°C
538A (Tc)
AttributeValue
Series-
PackagingTube
TechnologySilicon Carbide (SiC)
FET Feature-
Power - Max-
ManufacturerMicrochip Technology
Configuration-
Mounting TypeChassis Mount
Package / CaseModule
Vgs(th) (Max) @ Id-
Base Product NumberMSCSM70
Operating Temperature-
Rds On (Max) @ Id, Vgs-
Supplier Device PackageSP6C
Gate Charge (Qg) (Max) @ Vgs-
Drain to Source Voltage (Vdss)700V
Input Capacitance (Ciss) (Max) @ Vds-
Current - Continuous Drain (Id) @ 25°C538A (Tc)

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process