Fairchild Semiconductor FDS8936A

Fairchild Semiconductor FDS8936A electronic component product image

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Manufacturer No
FDS8936A
Availability
In Stock
Package
8-SOIC (0.154", 3.90mm Width)
Packaging
Bulk
Description
MOSFET 2N-CH 30V 6A 8SOIC
Detailed Description
Mosfet Array 30V 6A (Ta) 900mW (Ta) Surface Mount 8-SOIC
Datasheet
Payment
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Delivery
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AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
PowerTrench®
Packaging
Bulk
Technology
MOSFET (Metal Oxide)
FET Feature
-
Power - Max
900mW (Ta)
Manufacturer
Fairchild Semiconductor
Configuration
2 N-Channel (Dual)
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154", 3.90mm Width)
Vgs(th) (Max) @ Id
3V @ 250µA
Base Product Number
FDS89
Operating Temperature
-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs
28mOhm @ 6A, 10V
Supplier Device Package
8-SOIC
Gate Charge (Qg) (Max) @ Vgs
27nC @ 10V
Drain to Source Voltage (Vdss)
30V
Input Capacitance (Ciss) (Max) @ Vds
650pF @ 15V
Current - Continuous Drain (Id) @ 25°C
6A (Ta)
AttributeValue
SeriesPowerTrench®
PackagingBulk
TechnologyMOSFET (Metal Oxide)
FET Feature-
Power - Max900mW (Ta)
ManufacturerFairchild Semiconductor
Configuration2 N-Channel (Dual)
Mounting TypeSurface Mount
Package / Case8-SOIC (0.154", 3.90mm Width)
Vgs(th) (Max) @ Id3V @ 250µA
Base Product NumberFDS89
Operating Temperature-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs28mOhm @ 6A, 10V
Supplier Device Package8-SOIC
Gate Charge (Qg) (Max) @ Vgs27nC @ 10V
Drain to Source Voltage (Vdss)30V
Input Capacitance (Ciss) (Max) @ Vds650pF @ 15V
Current - Continuous Drain (Id) @ 25°C6A (Ta)

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping