EPC EPC2104ENGRT

Images are for reference only

Manufacturer

EPC

Manufacturer No

EPC2104ENGRT

Package

Die

Packaging

Tape & Reel (TR)

Description

MOSFET 2N-CH 100V 23A DIE

Detailed Description

Mosfet Array 100V 23A Surface Mount Die

Datasheet

EPC2104ENGRT

Payment

Delivery

Series

eGaN®

Packaging

Tape & Reel (TR)

Technology

GaNFET (Gallium Nitride)

FET Feature

-

Power - Max

-

Manufacturer

EPC

Configuration

2 N-Channel (Half Bridge)

Mounting Type

Surface Mount

Package / Case

Die

Vgs(th) (Max) @ Id

2.5V @ 5.5mA

Base Product Number

EPC210

Operating Temperature

-40°C ~ 150°C (TJ)

Rds On (Max) @ Id, Vgs

6.3mOhm @ 20A, 5V

Supplier Device Package

Die

Gate Charge (Qg) (Max) @ Vgs

7nC @ 5V

Drain to Source Voltage (Vdss)

100V

Input Capacitance (Ciss) (Max) @ Vds

800pF @ 50V

Current - Continuous Drain (Id) @ 25°C

23A

Attribute	Value
Series	eGaN®
Packaging	Tape & Reel (TR)
Technology	GaNFET (Gallium Nitride)
FET Feature	-
Power - Max	-
Manufacturer	EPC
Configuration	2 N-Channel (Half Bridge)
Mounting Type	Surface Mount
Package / Case	Die
Vgs(th) (Max) @ Id	2.5V @ 5.5mA
Base Product Number	EPC210
Operating Temperature	-40°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs	6.3mOhm @ 20A, 5V
Supplier Device Package	Die
Gate Charge (Qg) (Max) @ Vgs	7nC @ 5V
Drain to Source Voltage (Vdss)	100V
Input Capacitance (Ciss) (Max) @ Vds	800pF @ 50V
Current - Continuous Drain (Id) @ 25°C	23A

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Packaging Process