10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Efinix, Inc. TI375N900I4

Efinix, Inc. TI375N900I4 electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
TI375N900I4
Package
900-FBGA
Packaging
Tray
Description
FPGA TITAN 370KLE 2XGEN4 900BGA
Detailed Description
Titanium™ Field Programmable Gate Array (FPGA) IC 218 28867297 370137 900-FBGA
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Efinix, Inc.
Grade
-
Series
Titanium™
Packaging
Tray
Mounting Type
Surface Mount
Number of I/O
218
Qualification
-
Package / Case
900-FBGA
Total RAM Bits
28867297
Voltage - Supply
0.92V ~ 0.98V
Operating Temperature
-40°C ~ 100°C (TJ)
Supplier Device Package
900-FBGA (25x25)
Number of Logic Elements/Cells
370137
AttributeValue
MfrEfinix, Inc.
Grade-
SeriesTitanium™
PackagingTray
Mounting TypeSurface Mount
Number of I/O218
Qualification-
Package / Case900-FBGA
Total RAM Bits28867297
Voltage - Supply0.92V ~ 0.98V
Operating Temperature-40°C ~ 100°C (TJ)
Supplier Device Package900-FBGA (25x25)
Number of Logic Elements/Cells370137

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Packaging Process