Efinix, Inc. TI375C529C4

Efinix, Inc. TI375C529C4 electronic component product image

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Manufacturer
Manufacturer No
TI375C529C4
Package
529-BGA
Packaging
Tray
Description
FPGA TITAN 16TX 1.3KDSP 529FBGA
Detailed Description
Titanium™ Field Programmable Gate Array (FPGA) IC 227 28867297 370137 529-BGA
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Efinix, Inc.
Grade
Automotive
Series
Titanium™
Packaging
Tray
Mounting Type
Surface Mount
Number of I/O
227
Qualification
AEC-Q100
Package / Case
529-BGA
Total RAM Bits
28867297
Voltage - Supply
0.92V ~ 0.98V
Base Product Number
Ti375
Operating Temperature
0°C ~ 85°C (TJ)
Supplier Device Package
529-FBGA (19x19)
Number of Logic Elements/Cells
370137
AttributeValue
MfrEfinix, Inc.
GradeAutomotive
SeriesTitanium™
PackagingTray
Mounting TypeSurface Mount
Number of I/O227
QualificationAEC-Q100
Package / Case529-BGA
Total RAM Bits28867297
Voltage - Supply0.92V ~ 0.98V
Base Product NumberTi375
Operating Temperature0°C ~ 85°C (TJ)
Supplier Device Package529-FBGA (19x19)
Number of Logic Elements/Cells370137

Purchase & Inquiry

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping