Efinix, Inc. TI375N1156C4

Efinix, Inc. TI375N1156C4 electronic component product image

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Manufacturer
Manufacturer No
TI375N1156C4
Package
1156-BBGA
Packaging
Tray
Description
FPGA TITANIUM TI375 1156BGA
Detailed Description
Titanium™ Field Programmable Gate Array (FPGA) IC 337 28867297 370137 1156-BBGA
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Efinix, Inc.
Grade
-
Series
Titanium™
Packaging
Tray
Mounting Type
Surface Mount
Number of I/O
337
Qualification
-
Package / Case
1156-BBGA
Total RAM Bits
28867297
Voltage - Supply
0.92V ~ 0.98V
Operating Temperature
0°C ~ 85°C (TJ)
Supplier Device Package
1156-FBGA (35x35)
Number of Logic Elements/Cells
370137
AttributeValue
MfrEfinix, Inc.
Grade-
SeriesTitanium™
PackagingTray
Mounting TypeSurface Mount
Number of I/O337
Qualification-
Package / Case1156-BBGA
Total RAM Bits28867297
Voltage - Supply0.92V ~ 0.98V
Operating Temperature0°C ~ 85°C (TJ)
Supplier Device Package1156-FBGA (35x35)
Number of Logic Elements/Cells370137

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping