Toshiba Semiconductor and Storage 2SK3074TE12LF

Toshiba Semiconductor and Storage 2SK3074TE12LF electronic component product image

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Manufacturer No
2SK3074TE12LF
Package
TO-243AA
Packaging
Tape & Reel (TR); Cut Tape (CT)
Description
MOSF RF N CH 30V 1A PW-MINI
Detailed Description
RF Mosfet 9.6 V 50 mA 520MHz 14.9dB 630mW SC-62
Datasheet
Payment
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Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Gain
14.9dB
Series
-
Frequency
520MHz
Packaging
Tape & Reel (TR); Cut Tape (CT)
Technology
MOSFET (Metal Oxide)
Manufacturer
Toshiba Semiconductor and Storage
Noise Figure
-
Configuration
N-Channel
Current - Test
50 mA
Package / Case
TO-243AA
Power - Output
630mW
Voltage - Test
9.6 V
Voltage - Rated
30 V
Base Product Number
2SK3074
Current Rating (Amps)
1A
Supplier Device Package
SC-62
AttributeValue
Gain14.9dB
Series-
Frequency520MHz
PackagingTape & Reel (TR); Cut Tape (CT)
TechnologyMOSFET (Metal Oxide)
ManufacturerToshiba Semiconductor and Storage
Noise Figure-
ConfigurationN-Channel
Current - Test50 mA
Package / CaseTO-243AA
Power - Output630mW
Voltage - Test9.6 V
Voltage - Rated30 V
Base Product Number2SK3074
Current Rating (Amps)1A
Supplier Device PackageSC-62

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping