10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Teledyne e2v Semiconductors EV12DS460AMZPY

Teledyne e2v Semiconductors EV12DS460AMZPY electronic component product image

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Manufacturer No
EV12DS460AMZPY
Package
FPBGA
Description
DAC 1-CH 12-bit 196-Pin FPBGA
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8542.39.00.40
PPAP
No
EU RoHS
Compliant
Mounting
Surface Mount
ECCN (US)
3A001.a.5.b
Pin Count
196
Automotive
No
Resolution
12bit
Output Type
Voltage
PCB changed
196
Availability
No Stock Available
Package Width
15
Converter Type
General Purpose
Interface Type
Parallel|LVDS
Package Height
1.26
Package Length
15
Conversion Rate
6Gsps
Supplier Package
FPBGA
Power Supply Type
Analog and Digital
Signal to Noise Ratio
61dB(Typ)
Standard Package Name
BGA
Manufacturer Lead Time
12 weeks
Number of DAC Channels
1
Number of Outputs per Chip
1
Supplier Temperature Grade
Military
Integral Nonlinearity Error
±2.5LSB
Maximum Power Dissipation (mW)
3000
Minimum Single Supply Voltage (V)
3.15/4.75
AttributeValue
HTS8542.39.00.40
PPAPNo
EU RoHSCompliant
MountingSurface Mount
ECCN (US)3A001.a.5.b
Pin Count196
AutomotiveNo
Resolution12bit
Output TypeVoltage
PCB changed196
AvailabilityNo Stock Available
Package Width15
Converter TypeGeneral Purpose
Interface TypeParallel|LVDS
Package Height1.26
Package Length15
Conversion Rate6Gsps
Supplier PackageFPBGA
Power Supply TypeAnalog and Digital
Signal to Noise Ratio61dB(Typ)
Standard Package NameBGA
Manufacturer Lead Time12 weeks
Number of DAC Channels1
Number of Outputs per Chip1
Supplier Temperature GradeMilitary
Integral Nonlinearity Error±2.5LSB
Maximum Power Dissipation (mW)3000
Minimum Single Supply Voltage (V)3.15/4.75

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Important Notes

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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process