10-13 NOV 2026 · Munich, Germany

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Teledyne e2v Semiconductors EV12DS130AMGC

Teledyne e2v Semiconductors EV12DS130AMGC electronic component product image

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Manufacturer No
EV12DS130AMGC
Package
CCGA
Description
DAC 1-CH Current Steering 12-bit 255-Pin CCGA
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8542.39.00.40
PPAP
No
EU RoHS
Supplier Unconfirmed
Mounting
Through Hole
ECCN (US)
3A001a.5.b.
Pin Count
255
Automotive
No
Resolution
12bit
Output Type
Voltage
PCB changed
255
Architecture
Current Steering
Availability
No Stock Available
Package Width
21
Interface Type
LVDS
Package Height
2.23
Package Length
21
Conversion Rate
3Gsps
Supplier Package
CCGA
Power Supply Type
Analog and Digital
Signal to Noise Ratio
66.7dB(Typ)
Manufacturer Lead Time
20 weeks
Number of DAC Channels
1
Number of Outputs per Chip
1
Integral Nonlinearity Error
±3LSB
Maximum Power Dissipation (mW)
1600
Minimum Single Supply Voltage (V)
3.15/4.75
AttributeValue
HTS8542.39.00.40
PPAPNo
EU RoHSSupplier Unconfirmed
MountingThrough Hole
ECCN (US)3A001a.5.b.
Pin Count255
AutomotiveNo
Resolution12bit
Output TypeVoltage
PCB changed255
ArchitectureCurrent Steering
AvailabilityNo Stock Available
Package Width21
Interface TypeLVDS
Package Height2.23
Package Length21
Conversion Rate3Gsps
Supplier PackageCCGA
Power Supply TypeAnalog and Digital
Signal to Noise Ratio66.7dB(Typ)
Manufacturer Lead Time20 weeks
Number of DAC Channels1
Number of Outputs per Chip1
Integral Nonlinearity Error±3LSB
Maximum Power Dissipation (mW)1600
Minimum Single Supply Voltage (V)3.15/4.75

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Packaging Process