Samsung Semiconductor, Inc. K4F8E304HB-MGCJ

Samsung Semiconductor, Inc. K4F8E304HB-MGCJ electronic component product image

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Manufacturer No
K4F8E304HB-MGCJ
Quantity
74,582
Availability
In Stock
Package
200-TFBGA
Packaging
Tray
Description
LPDDR4 8Gb x32 3733 Mbps 1.1v 20
Detailed Description
Memory IC 8Gbit Parallel 1866 MHz
Payment
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Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Samsung Semiconductor, Inc.
Series
-
Packaging
Tray
Memory Size
8Gbit
Memory Type
Volatile
Memory Format
DRAM
Mounting Type
Surface Mount
Package / Case
200-TFBGA
Clock Frequency
1866 MHz
Memory Interface
Parallel
Voltage - Supply
1.1V
Memory Organization
256M x 32
DigiKey Programmable
Not Verified
Operating Temperature
-25°C ~ 85°C
AttributeValue
MfrSamsung Semiconductor, Inc.
Series-
PackagingTray
Memory Size8Gbit
Memory TypeVolatile
Memory FormatDRAM
Mounting TypeSurface Mount
Package / Case200-TFBGA
Clock Frequency1866 MHz
Memory InterfaceParallel
Voltage - Supply1.1V
Memory Organization256M x 32
DigiKey ProgrammableNot Verified
Operating Temperature-25°C ~ 85°C

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
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