Samsung Semiconductor, Inc. K4B4G1646E-BYK000

Samsung Semiconductor, Inc. K4B4G1646E-BYK000 electronic component product image

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Manufacturer No
K4B4G1646E-BYK000
Quantity
77,820
Availability
In Stock
Package
96-TFBGA
Packaging
Tray
Description
DDR3-1600 4GB (256MX16)1.25NS CL
Detailed Description
Memory IC 4Gbit Parallel 800 MHz
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Samsung Semiconductor, Inc.
Series
-
Packaging
Tray
Memory Size
4Gbit
Memory Type
Volatile
Memory Format
DRAM
Mounting Type
Surface Mount
Package / Case
96-TFBGA
Clock Frequency
800 MHz
Memory Interface
Parallel
Voltage - Supply
1.35V
Memory Organization
256M x 16
DigiKey Programmable
Not Verified
Operating Temperature
0°C ~ 95°C
AttributeValue
MfrSamsung Semiconductor, Inc.
Series-
PackagingTray
Memory Size4Gbit
Memory TypeVolatile
Memory FormatDRAM
Mounting TypeSurface Mount
Package / Case96-TFBGA
Clock Frequency800 MHz
Memory InterfaceParallel
Voltage - Supply1.35V
Memory Organization256M x 16
DigiKey ProgrammableNot Verified
Operating Temperature0°C ~ 95°C

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
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