10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Same Sky (Formerly CUI Devices) HSS06-C20-P32

Same Sky (Formerly CUI Devices) HSS06-C20-P32 electronic component product image

Image is only for reference

Manufacturer No
HSS06-C20-P32
Packaging
Box
Description
HEAT SINK, STAMPING, TO-220, 27.
Detailed Description
Heat Sink TO-220 Copper Alloy 3.0W @ 75°C Board Level, Vertical
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Mfr
Same Sky (Formerly CUI Devices)
Type
Board Level, Vertical
Shape
Rectangular
Width
0.866" (22.00mm)
Length
1.101" (27.96mm)
Series
HSS
Diameter
-
Material
Copper Alloy
Packaging
Box
Fin Height
0.375" (9.52mm)
Package Cooled
TO-220
Material Finish
Tin
Attachment Method
PC Pin
Thermal Resistance @ Natural
25.35°C/W
Power Dissipation @ Temperature Rise
3.0W @ 75°C
Thermal Resistance @ Forced Air Flow
10.60°C/W @ 200 LFM
AttributeValue
MfrSame Sky (Formerly CUI Devices)
TypeBoard Level, Vertical
ShapeRectangular
Width0.866" (22.00mm)
Length1.101" (27.96mm)
SeriesHSS
Diameter-
MaterialCopper Alloy
PackagingBox
Fin Height0.375" (9.52mm)
Package CooledTO-220
Material FinishTin
Attachment MethodPC Pin
Thermal Resistance @ Natural25.35°C/W
Power Dissipation @ Temperature Rise3.0W @ 75°C
Thermal Resistance @ Forced Air Flow10.60°C/W @ 200 LFM

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Packaging Process