Same Sky (Formerly CUI Devices) HSS02-B20-P318

Images are for reference only

Manufacturer

Same Sky (Formerly CUI Devices)

Manufacturer No

HSS02-B20-P318

Packaging

Box

Description

HEAT SINK, STAMPING, TO-220, 23.

Detailed Description

Heat Sink TO-220 Aluminum Alloy 6.9W @ 75°C Board Level, Vertical

Datasheet

HSS02-B20-P318

Payment

Delivery

Mfr

Same Sky (Formerly CUI Devices)

Type

Board Level, Vertical

Shape

Rectangular

Width

0.930" (23.62mm)

Length

1.900" (48.26mm)

Series

HSS

Diameter

-

Material

Aluminum Alloy

Packaging

Box

Fin Height

0.950" (24.13mm)

Package Cooled

TO-220

Material Finish

Black Anodized

Attachment Method

Bolt On and PC Pin

Thermal Resistance @ Natural

10.90°C/W

Power Dissipation @ Temperature Rise

6.9W @ 75°C

Thermal Resistance @ Forced Air Flow

4.80°C/W @ 200 LFM

Attribute	Value
Mfr	Same Sky (Formerly CUI Devices)
Type	Board Level, Vertical
Shape	Rectangular
Width	0.930" (23.62mm)
Length	1.900" (48.26mm)
Series	HSS
Diameter	-
Material	Aluminum Alloy
Packaging	Box
Fin Height	0.950" (24.13mm)
Package Cooled	TO-220
Material Finish	Black Anodized
Attachment Method	Bolt On and PC Pin
Thermal Resistance @ Natural	10.90°C/W
Power Dissipation @ Temperature Rise	6.9W @ 75°C
Thermal Resistance @ Forced Air Flow	4.80°C/W @ 200 LFM

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Packaging Process