10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Qualcomm CSRA63220A11-IBBC-R

Qualcomm CSRA63220A11-IBBC-R electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
CSRA63220A11-IBBC-R
Package
BGA
Description
SOC QCC300x 68-Pin BGA
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
CAN
0
HTS
8542.31.00.70
I2C
1
I2S
0
PCI
0
SPI
1
USB
1
PPAP
Unknown
Type
System-On-Chip
UART
1
USART
0
EU RoHS
Supplier Unconfirmed
Ethernet
0
Mounting
Surface Mount
ECCN (US)
5A992.c
Pin Count
68
Automotive
Yes
Lead Shape
Ball
Family Name
QCC300x
PCB changed
68
Availability
No Stock Available
Interface Type
I2C/SPI/UART/USB
Processing Unit
Microcontroller
Programmability
Yes
Supplier Package
BGA
Program Memory Type
Flash
Standard Package Name
BGA
Maximum Clock Frequency (MHz)
80
AttributeValue
CAN0
HTS8542.31.00.70
I2C1
I2S0
PCI0
SPI1
USB1
PPAPUnknown
TypeSystem-On-Chip
UART1
USART0
EU RoHSSupplier Unconfirmed
Ethernet0
MountingSurface Mount
ECCN (US)5A992.c
Pin Count68
AutomotiveYes
Lead ShapeBall
Family NameQCC300x
PCB changed68
AvailabilityNo Stock Available
Interface TypeI2C/SPI/UART/USB
Processing UnitMicrocontroller
ProgrammabilityYes
Supplier PackageBGA
Program Memory TypeFlash
Standard Package NameBGA
Maximum Clock Frequency (MHz)80

Purchase & Inquiry

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RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process