Qualcomm QCC-744-2-MQFN56-TR-01-0

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Manufacturer

Qualcomm

Manufacturer No

QCC-744-2-MQFN56-TR-01-0

Package

56-VFQFN

Packaging

Cut Tape (CT)

Description

QCC-744-2-MQFN56-TR-01-0.

Detailed Description

RISC-V System On Chip (SOC) IC Qualcomm® QCC740 325MHz 56-QFN (7x7)

Payment

Delivery

Grade

-

Speed

325MHz

Series

Qualcomm® QCC740

RAM Size

484KB

Packaging

Cut Tape (CT)

Flash Size

128KB

Peripherals

I2S, PWM

Architecture

DSP, MCU

Connectivity

CANbus, I2C, SDIO, SPI, UART/USART

Manufacturer

Qualcomm

Number of I/O

35

Qualification

-

Core Processor

RISC-V

Package / Case

56-VFQFN

Primary Attributes

-

Operating Temperature

-40°C ~ 105°C

Supplier Device Package

56-QFN (7x7)

Attribute	Value
Grade	-
Speed	325MHz
Series	Qualcomm® QCC740
RAM Size	484KB
Packaging	Cut Tape (CT)
Flash Size	128KB
Peripherals	I2S, PWM
Architecture	DSP, MCU
Connectivity	CANbus, I2C, SDIO, SPI, UART/USART
Manufacturer	Qualcomm
Number of I/O	35
Qualification	-
Core Processor	RISC-V
Package / Case	56-VFQFN
Primary Attributes	-
Operating Temperature	-40°C ~ 105°C
Supplier Device Package	56-QFN (7x7)

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Packaging Process