10-13 NOV 2026 · Munich, Germany

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onsemi NXH022S120M3F1PTG

onsemi NXH022S120M3F1PTG electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
NXH022S120M3F1PTG
Package
Module
Packaging
Tray
Description
22M OHM 1200V 40A M3S SIC 6-PACK
Detailed Description
Mosfet Array 1200V (1.2kV) 48A (Tc) 116W Through Hole
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Grade
-
Series
-
Packaging
Tray
Technology
Silicon Carbide (SiC)
FET Feature
-
Power - Max
116W
Manufacturer
onsemi
Configuration
6 N-Channel (Full Bridge)
Mounting Type
Through Hole
Qualification
-
Package / Case
Module
Vgs(th) (Max) @ Id
4.4V @ 20mA
Base Product Number
NXH022
Operating Temperature
-40°C ~ 175°C
Rds On (Max) @ Id, Vgs
30mOhm @ 50A, 18V
Supplier Device Package
-
Gate Charge (Qg) (Max) @ Vgs
138nC @ 18V
Drain to Source Voltage (Vdss)
1200V (1.2kV)
Input Capacitance (Ciss) (Max) @ Vds
3246pF @ 800V
Current - Continuous Drain (Id) @ 25°C
48A (Tc)
AttributeValue
Grade-
Series-
PackagingTray
TechnologySilicon Carbide (SiC)
FET Feature-
Power - Max116W
Manufactureronsemi
Configuration6 N-Channel (Full Bridge)
Mounting TypeThrough Hole
Qualification-
Package / CaseModule
Vgs(th) (Max) @ Id4.4V @ 20mA
Base Product NumberNXH022
Operating Temperature-40°C ~ 175°C
Rds On (Max) @ Id, Vgs30mOhm @ 50A, 18V
Supplier Device Package-
Gate Charge (Qg) (Max) @ Vgs138nC @ 18V
Drain to Source Voltage (Vdss)1200V (1.2kV)
Input Capacitance (Ciss) (Max) @ Vds3246pF @ 800V
Current - Continuous Drain (Id) @ 25°C48A (Tc)

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Packaging Process