NXP Semiconductors BGU8009,115
Image is only for reference
| Attribute | Value |
|---|---|
| HTS | 8542.33.00.01 |
| PPAP | No |
| SVHC | Yes |
| Type | Low Noise Amplifier |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 6 |
| Automotive | No |
| Lead Shape | No Lead |
| PCB changed | 6 |
| Availability | In Stock (cut strips) |
| Package Width | 0.9 |
| Package Height | 0.46(Max) |
| Package Length | 1.1 |
| Supplier Package | XSON |
| Maximum Gain (dB) | 20.2(Typ)@1850MHz |
| Power Supply Type | Single |
| Standard Package Name | SON |
| Manufacturer Lead Time | 99 weeks |
| Module/IC Classification | Chip |
| Typical Noise Figure (dB) | 1.2@1850MHz |
| Maximum Supply Current (mA) | [email protected] |
| Number of Channels per Chip | 1 |
| Maximum Input Return Loss (dB) | 11(Typ)@1575MHz |
| Maximum Power Dissipation (mW) | 55 |
| Maximum Reverse Isolation (dB) | 37(Typ)@1575MHz |
| Maximum Output Return Loss (dB) | 15(Typ)@1575MHz |
| Maximum Operating Frequency (MHz) | 1610 |
| Maximum Single Supply Voltage (V) | 3.1 |
| Minimum Single Supply Voltage (V) | 1.5 |
| Typical Single Supply Voltage (V) | 3 |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
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Packaging Process
