10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

NXP Semiconductors BGA3031X

NXP Semiconductors BGA3031X electronic component product image

Image is only for reference

Manufacturer
Manufacturer No
BGA3031X
Package
20-VQFN Exposed Pad
Packaging
Bulk
Description
BGA3031 - DOCSIS 3.0 PLUS UPSTRE
Detailed Description
RF Amplifier IC 20-HVQFN (5x5)
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Series
-
Packaging
Bulk
Manufacturer
NXP Semiconductors
Mounting Type
Surface Mount
Package / Case
20-VQFN Exposed Pad
Supplier Device Package
20-HVQFN (5x5)
AttributeValue
Series-
PackagingBulk
ManufacturerNXP Semiconductors
Mounting TypeSurface Mount
Package / Case20-VQFN Exposed Pad
Supplier Device Package20-HVQFN (5x5)

Purchase & Inquiry

Placing an Order

You can place an order with FIXCHIPS without having to register or create an account.

Payment Options

To make payment more convenient, we support multiple payment methods in USD, including PayPal, credit cards, and wire transfer.

RFQ (Request for Quote)

We suggest submitting an RFQ to get the most up-to-date pricing and availability for the components you are looking for. Our sales team will reply by email within 24 hours.

Important Notes

1. An email containing your order details will be sent to your inbox. If you cannot find it, please check your spam or junk mail folder.

2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.

Packaging Process