NXP Semiconductors BGU7258X
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| Attribute | Value |
|---|---|
| HTS | 8542.33.00.01 |
| PPAP | No |
| Type | Low Noise Amplifier |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 6 |
| Automotive | No |
| PCB changed | 6 |
| Availability | In Stock (cut strips) |
| Package Width | 1.6 |
| Package Height | 0.45(Max) |
| Package Length | 1.6 |
| Supplier Package | HXSON EP |
| Power Supply Type | Single |
| Standard Package Name | SON |
| Manufacturer Lead Time | 99 weeks |
| Typical Power Gain (dB) | 13@59000MHz |
| Typical Noise Figure (dB) | 1.6@5500MHz |
| Typical Gain Flatness (dB) | ±0.2 |
| Maximum Supply Current (mA) | 13(Typ) |
| Number of Channels per Chip | 1 |
| Maximum Input Return Loss (dB) | 17(Typ)@5500MHz |
| Maximum Reverse Isolation (dB) | 20(Typ)@5500MHz |
| Maximum Output Return Loss (dB) | 18(Typ)@5500MHz |
| Maximum Operating Frequency (MHz) | 5925 |
| Minimum Single Supply Voltage (V) | 3 |
| Typical Single Supply Voltage (V) | 3.3 |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 3.6 |
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Packaging Process
