NXP Semiconductors BGA3031J
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| Attribute | Value |
|---|---|
| HTS | 8542.33.00.01 |
| PPAP | No |
| Type | Upstream Amplifier |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 20 |
| Automotive | No |
| Lead Shape | No Lead |
| PCB changed | 20 |
| Availability | No Stock Available |
| Package Width | 5.1(Max) |
| Package Height | 0.95(Max) |
| Package Length | 5.1(Max) |
| Supplier Package | HVQFN EP |
| Power Supply Type | Single |
| Standard Package Name | QFN |
| Typical Noise Figure (dB) | 6.5 |
| Typical Gain Flatness (dB) | ±0.6 |
| Maximum Supply Current (mA) | 325(Typ)@5V |
| Number of Channels per Chip | 1 |
| Maximum Power Dissipation (mW) | 1625(Typ) |
| Maximum Reverse Isolation (dB) | 90(Typ) |
| Maximum Operating Frequency (MHz) | 85 |
| Typical Single Supply Voltage (V) | 5 |
| Maximum Operating Temperature (°C) | 85 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 6 |
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Packaging Process
