NXP Semiconductors BGA2866,115
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| Attribute | Value |
|---|---|
| HTS | COMPONENTS |
| PPAP | No |
| SVHC | Yes |
| Type | MMIC Amplifier |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 6 |
| Automotive | No |
| Lead Shape | Gull-wing |
| PCB changed | 6 |
| Availability | In Stock (cut strips) |
| Package Width | 1.35(Max) |
| Package Height | 1(Max) |
| Package Length | 2.2(Max) |
| Supplier Package | TSSOP |
| Power Supply Type | Single |
| Standard Package Name | SO |
| Manufacturer Lead Time | 99 weeks |
| Typical Power Gain (dB) | 24.3@2150MHz |
| Typical Noise Figure (dB) | 3.9@2150MHz |
| Typical Output Power (dBm) | 3@2150MHz |
| Maximum Supply Current (mA) | 20.1@5V |
| Number of Channels per Chip | 1 |
| Typical 3dB Bandwidth (MHz) | 3300 |
| Maximum Input Return Loss (dB) | 24@2150MHz |
| Maximum Power Dissipation (mW) | 200 |
| Maximum Reverse Isolation (dB) | 37@2150MHz |
| Maximum Output Return Loss (dB) | 14@2150MHz |
| Maximum Operating Frequency (MHz) | 2200 |
| Minimum Single Supply Voltage (V) | 4.5 |
| Typical Single Supply Voltage (V) | 5 |
| Maximum Operating Temperature (°C) | 125 |
| Maximum Operating Supply Voltage (V) | 5.5 |
| Typical Output Intercept Point (dBm) | 12@2151MHz |
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Packaging Process
