Microchip Technology MPFS250T-FCSG536I

Microchip Technology MPFS250T-FCSG536I electronic component product image

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Manufacturer No
MPFS250T-FCSG536I
Availability
In Stock
Package
536-LFBGA, CSPBGA
Packaging
Tray
Description
IC SOC RISC-V 536LFBGA
Detailed Description
RISC-V System On Chip (SOC) IC PolarFire® FPGA - 254K Logic Modules 536-LFBGA
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
-
Series
PolarFire®
RAM Size
2.2MB
Packaging
Tray
Flash Size
128kB
Peripherals
DMA, PCI, PWM
Architecture
MPU, FPGA
Connectivity
CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Manufacturer
Microchip Technology
Number of I/O
MCU - 136, FPGA - 372
Core Processor
RISC-V
Package / Case
536-LFBGA, CSPBGA
Primary Attributes
FPGA - 254K Logic Modules
Operating Temperature
-40°C ~ 100°C
Supplier Device Package
536-LFBGA
AttributeValue
Speed-
SeriesPolarFire®
RAM Size2.2MB
PackagingTray
Flash Size128kB
PeripheralsDMA, PCI, PWM
ArchitectureMPU, FPGA
ConnectivityCAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
ManufacturerMicrochip Technology
Number of I/OMCU - 136, FPGA - 372
Core ProcessorRISC-V
Package / Case536-LFBGA, CSPBGA
Primary AttributesFPGA - 254K Logic Modules
Operating Temperature-40°C ~ 100°C
Supplier Device Package536-LFBGA

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping