Step1: Product
Microchip Technology MPFS250TL-FCG1152E
Images are for reference only
Manufacturer
Manufacturer No
MPFS250TL-FCG1152E
Availability
In Stock
Package
1152-BBGA, FCBGA
Packaging
Tray
Description
IC SOC RISC-V 1152FCBGA
Detailed Description
RISC-V System On Chip (SOC) IC PolarFire® FPGA - 254K Logic Modules 1152-FCBGA (35x35)
Datasheet
Payment
Delivery
Speed
-
Series
PolarFire®
RAM Size
2.2MB
Packaging
Tray
Flash Size
128kB
Peripherals
DMA, PCI, PWM
Architecture
MPU, FPGA
Connectivity
CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG
Manufacturer
Microchip Technology
Number of I/O
MCU - 136, FPGA - 372
Core Processor
RISC-V
Package / Case
1152-BBGA, FCBGA
Primary Attributes
FPGA - 254K Logic Modules
Operating Temperature
0°C ~ 100°C
Supplier Device Package
1152-FCBGA (35x35)
| Attribute | Value |
|---|---|
| Speed | - |
| Series | PolarFire® |
| RAM Size | 2.2MB |
| Packaging | Tray |
| Flash Size | 128kB |
| Peripherals | DMA, PCI, PWM |
| Architecture | MPU, FPGA |
| Connectivity | CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG |
| Manufacturer | Microchip Technology |
| Number of I/O | MCU - 136, FPGA - 372 |
| Core Processor | RISC-V |
| Package / Case | 1152-BBGA, FCBGA |
| Primary Attributes | FPGA - 254K Logic Modules |
| Operating Temperature | 0°C ~ 100°C |
| Supplier Device Package | 1152-FCBGA (35x35) |
Purchase & Inquiry
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Important Notes
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2. Product availability and pricing may change over time. Our sales manager will verify the details of your order and contact you if any changes or confirmation are required.
Packaging Process
Step2: Vacuum Packaging
Step3: Anti-Static Bag
Step4: Package Boxes
Step5: Bar-Code Shipping Tags
Step6: Shipping
