Step1: Product
Microchip Technology M2S150-1FCVG484I
Images are for reference only
Manufacturer
Manufacturer No
M2S150-1FCVG484I
Availability
In Stock
Package
484-BFBGA
Packaging
Tray
Description
IC SOC CORTEX-M3 166MHZ 484FBGA
Detailed Description
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 150K Logic Modules 166MHz 484-FBGA (19x19)
Datasheet
Payment
Delivery
Speed
166MHz
Series
SmartFusion®2
RAM Size
64KB
Packaging
Tray
Flash Size
512KB
Peripherals
DDR, PCIe, SERDES
Architecture
MCU, FPGA
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Manufacturer
Microchip Technology
Number of I/O
273
Core Processor
ARM® Cortex®-M3
Package / Case
484-BFBGA
Primary Attributes
FPGA - 150K Logic Modules
Base Product Number
M2S150
Operating Temperature
-40°C ~ 100°C (TJ)
Supplier Device Package
484-FBGA (19x19)
| Attribute | Value |
|---|---|
| Speed | 166MHz |
| Series | SmartFusion®2 |
| RAM Size | 64KB |
| Packaging | Tray |
| Flash Size | 512KB |
| Peripherals | DDR, PCIe, SERDES |
| Architecture | MCU, FPGA |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Manufacturer | Microchip Technology |
| Number of I/O | 273 |
| Core Processor | ARM® Cortex®-M3 |
| Package / Case | 484-BFBGA |
| Primary Attributes | FPGA - 150K Logic Modules |
| Base Product Number | M2S150 |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Supplier Device Package | 484-FBGA (19x19) |
Purchase & Inquiry
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Packaging Process
Step2: Vacuum Packaging
Step3: Anti-Static Bag
Step4: Package Boxes
Step5: Bar-Code Shipping Tags
Step6: Shipping
