Microchip Technology M2S150TS-WAFERLOT

Microchip Technology M2S150TS-WAFERLOT electronic component product image

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Manufacturer No
M2S150TS-WAFERLOT
Package
Die
Packaging
Bulk
Description
M2S150TS-WAFERLOT
Detailed Description
ARM® Cortex®-M3 System On Chip (SOC) IC SmartFusion®2 FPGA - 150K Logic Modules 166MHz Wafer
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
Speed
166MHz
Series
SmartFusion®2
RAM Size
64KB
Packaging
Bulk
Flash Size
512KB
Peripherals
DDR, PCIe, SERDES
Architecture
MCU, FPGA
Connectivity
CANbus, Ethernet, I2C, SPI, UART/USART, USB
Manufacturer
Microchip Technology
Number of I/O
-
Core Processor
ARM® Cortex®-M3
Package / Case
Die
Primary Attributes
FPGA - 150K Logic Modules
Operating Temperature
-
Supplier Device Package
Wafer
AttributeValue
Speed166MHz
SeriesSmartFusion®2
RAM Size64KB
PackagingBulk
Flash Size512KB
PeripheralsDDR, PCIe, SERDES
ArchitectureMCU, FPGA
ConnectivityCANbus, Ethernet, I2C, SPI, UART/USART, USB
ManufacturerMicrochip Technology
Number of I/O-
Core ProcessorARM® Cortex®-M3
Package / CaseDie
Primary AttributesFPGA - 150K Logic Modules
Operating Temperature-
Supplier Device PackageWafer

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Packaging Process

Product before packing
Step1: Product
Product in vacuum packaging
Step2: Vacuum Packaging
Product in anti-static bag
Step3: Anti-Static Bag
Individual packaging box
Step4: Package Boxes
Packaging box with shipping label
Step5: Bar-Code Shipping Tags
Shipping by cargo vessel
Step6: Shipping