Microchip Technology GRP-B-DATA-JAN2N4033
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| Attribute | Value |
|---|---|
| HTS | EA |
| PPAP | No |
| Type | PNP |
| EU RoHS | Not Compliant |
| Category | Bipolar Power |
| Diameter | 9.4(Max) |
| Material | Si |
| Mounting | Through Hole |
| ECCN (US) | EAR99 |
| Packaging | Bag |
| Pin Count | 3 |
| Automotive | No |
| Lead Shape | Through Hole |
| PCB changed | 3 |
| Availability | No Stock Available |
| Configuration | Single |
| Package Height | 6.6(Max) |
| Supplier Package | TO-39 |
| Standard Package Name | TO |
| Minimum DC Current Gain | 70@500mA@5V|[email protected]@5V|100@100mA@5V|25@1A@5V |
| Supplier Temperature Grade | Military |
| Number of Elements per Chip | 1 |
| Maximum Power Dissipation (mW) | 800 |
| Maximum Base-Emitter Voltage (V) | 5 |
| Maximum DC Collector Current (A) | 1 |
| Maximum Collector-Base Voltage (V) | 80 |
| Maximum Operating Temperature (°C) | 200 |
| Minimum Operating Temperature (°C) | -55 |
| Operating Junction Temperature (°C) | -55 to 200 |
| Maximum Collector-Emitter Voltage (V) | 80 |
| Maximum Base-Emitter Saturation Voltage (V) | 0.9@15mA@150mA|1.2@50mA@500mA |
| Maximum Collector-Emitter Saturation Voltage (V) | 0.15@15mA@150mA|0.5@50mA@500mA|1@100mA@1A |
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Packaging Process
