Microchip Technology GRP-A-DATA-JAN2N6990
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| Attribute | Value |
|---|---|
| HTS | EA |
| PPAP | No |
| Type | NPN |
| EU RoHS | Not Compliant |
| Category | Bipolar Power |
| Material | Si |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tray |
| Pin Count | 14 |
| Automotive | No |
| Lead Shape | Flat |
| PCB changed | 14 |
| Availability | No Stock Available |
| Configuration | Quad |
| Package Width | 6.6(Max) |
| Package Height | 2.4(Max) |
| Package Length | 7.11(Max) |
| Supplier Package | FPAK |
| Minimum DC Current Gain | [email protected]@10V|75@1mA@10V|100@10mA@10V|100@150mA@10V|30@500mA@10V |
| Supplier Temperature Grade | Military |
| Number of Elements per Chip | 4 |
| Maximum Power Dissipation (mW) | 400 |
| Maximum Base-Emitter Voltage (V) | 6 |
| Maximum DC Collector Current (A) | 0.8 |
| Maximum Collector-Base Voltage (V) | 75 |
| Maximum Operating Temperature (°C) | 200 |
| Minimum Operating Temperature (°C) | -65 |
| Maximum Collector-Emitter Voltage (V) | 50 |
| Maximum Base-Emitter Saturation Voltage (V) | 1.2@15mA@150mA|2@50mA@500mA |
| Maximum Collector-Emitter Saturation Voltage (V) | 0.3@15mA@150mA|1@50mA@500mA |
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Packaging Process
