Isocom Components 2004 LTD ISP817XGB
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| Attribute | Value |
|---|---|
| HTS | EA |
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Through Hole |
| ECCN (US) | EAR99 |
| Pin Count | 4 |
| Standards | DEMKO|FIMKO|NEMKO|SEMKO|UL|VDE |
| Automotive | No |
| Input Type | DC |
| Lead Shape | Wide Lead Spacing Through Hole |
| Output Type | DC |
| PCB changed | 4 |
| Availability | No Stock Available |
| Output Device | Transistor |
| Package Width | 7(Max) |
| Package Height | 4(Max) |
| Package Length | 5.08(Max) |
| Supplier Package | PDIP |
| Standard Package Name | DIP |
| Manufacturer Lead Time | 3 weeks |
| Maximum Fall Time (us) | 18 |
| Maximum Rise Time (us) | 18 |
| Typical Fall Time (us) | 3 |
| Typical Rise Time (us) | 4 |
| Maximum Forward Voltage (V) | 1.4 |
| Maximum Reverse Voltage (V) | 6 |
| Number of Channels per Chip | 1 |
| Typical Forward Voltage (V) | 1.2 |
| Maximum Forward Current (mA) | 50 |
| Maximum Collector Current (mA) | 50 |
| Maximum Power Dissipation (mW) | 200 |
| Minimum Isolation Voltage (Vrms) | 5000 |
| Maximum Current Transfer Ratio (%) | 600 |
| Minimum Current Transfer Ratio (%) | 100 |
| Maximum Operating Temperature (°C) | 110 |
| Minimum Operating Temperature (°C) | -55 |
| Current Transfer Ratio Test Current (mA) | 5 |
| Maximum Collector-Emitter Saturation Voltage (mV) | 200 |
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Packaging Process
