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Isocom Components 2004 LTD ISP817AG

Isocom Components 2004 LTD ISP817AG electronic component product image

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Manufacturer No
ISP817AG
Package
PDIP
Description
Optocoupler DC-IN 1-CH Transistor DC-OUT 4-Pin PDIP
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8541.49.80.00
PPAP
No
EU RoHS
Compliant
Mounting
Through Hole
ECCN (US)
EAR99
Pin Count
4
Standards
UL|VDE
Automotive
No
Input Type
DC
Lead Shape
Through Hole
Output Type
DC
PCB changed
4
Availability
No Stock Available
Output Device
Transistor
Package Width
6.5
Package Height
3.5
Package Length
4.6
Supplier Package
PDIP
Standard Package Name
DIP
Manufacturer Lead Time
3 weeks
Maximum Fall Time (us)
18
Maximum Rise Time (us)
18
Typical Fall Time (us)
3
Typical Rise Time (us)
4
Maximum Forward Voltage (V)
1.4
Maximum Reverse Voltage (V)
6
Number of Channels per Chip
1
Typical Forward Voltage (V)
1.2
Maximum Forward Current (mA)
50
Maximum Collector Current (mA)
50
Maximum Power Dissipation (mW)
200
Minimum Isolation Voltage (Vrms)
5000
Maximum Current Transfer Ratio (%)
160
Minimum Current Transfer Ratio (%)
80
Maximum Operating Temperature (°C)
110
Minimum Operating Temperature (°C)
-55
Maximum Collector-Emitter Voltage (V)
80
Current Transfer Ratio Test Current (mA)
5
Maximum Collector-Emitter Saturation Voltage (mV)
200
AttributeValue
HTS8541.49.80.00
PPAPNo
EU RoHSCompliant
MountingThrough Hole
ECCN (US)EAR99
Pin Count4
StandardsUL|VDE
AutomotiveNo
Input TypeDC
Lead ShapeThrough Hole
Output TypeDC
PCB changed4
AvailabilityNo Stock Available
Output DeviceTransistor
Package Width6.5
Package Height3.5
Package Length4.6
Supplier PackagePDIP
Standard Package NameDIP
Manufacturer Lead Time3 weeks
Maximum Fall Time (us)18
Maximum Rise Time (us)18
Typical Fall Time (us)3
Typical Rise Time (us)4
Maximum Forward Voltage (V)1.4
Maximum Reverse Voltage (V)6
Number of Channels per Chip1
Typical Forward Voltage (V)1.2
Maximum Forward Current (mA)50
Maximum Collector Current (mA)50
Maximum Power Dissipation (mW)200
Minimum Isolation Voltage (Vrms)5000
Maximum Current Transfer Ratio (%)160
Minimum Current Transfer Ratio (%)80
Maximum Operating Temperature (°C)110
Minimum Operating Temperature (°C)-55
Maximum Collector-Emitter Voltage (V)80
Current Transfer Ratio Test Current (mA)5
Maximum Collector-Emitter Saturation Voltage (mV)200

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