Integrated Device Technology R9A06G043GBG#AC0
Image is only for reference
| Attribute | Value |
|---|---|
| CAN | 1 |
| I2C | 1 |
| I2S | 0 |
| SPI | 2 |
| USB | 1 |
| PPAP | No |
| UART | 0 |
| USART | 0 |
| EU RoHS | Compliant |
| Ethernet | 2 |
| Mounting | Surface Mount |
| ECCN (US) | 3A991a.2. |
| Packaging | Tray |
| Pin Count | 196 |
| Automotive | No |
| Lead Shape | Ball |
| Device Core | ARM Cortex R4 |
| Family Name | RZ |
| PCB changed | 196 |
| Availability | No Stock Available |
| No. of Timers | 3 |
| Package Width | 12 |
| Interface Type | CAN/I2C/SPI/UART/USB |
| Number of I/Os | 115 |
| Package Height | 1.15(Max) |
| Package Length | 12 |
| Programmability | No |
| Supplier Package | LFBGA |
| Core Architecture | ARM |
| Data Bus Width (bit) | 32 |
| Standard Package Name | BGA |
| Maximum CPU Frequency (MHz) | 150 |
| Instruction Set Architecture | RISC |
| Maximum Clock Frequency (MHz) | 150 |
| Maximum Operating Temperature (°C) | 125 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Supply Voltage (V) | 3 |
| Typical Operating Supply Voltage (V) | 3.3 |
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Packaging Process
