Integrated Device Technology R9A06G033NGBG#AC1
Image is only for reference
| Attribute | Value |
|---|---|
| CAN | 2 |
| I2C | 2 |
| I2S | 0 |
| SPI | 6 |
| USB | 2 |
| PPAP | No |
| UART | 8 |
| USART | 0 |
| EU RoHS | Compliant |
| Ethernet | 0 |
| Mounting | Surface Mount |
| RAM Size | 6MB |
| ECCN (US) | 3A991a.2. |
| Packaging | Tray |
| Pin Count | 324 |
| Automotive | No |
| Lead Shape | Ball |
| Device Core | ARM Cortex M3|ARM Cortex A7 |
| Family Name | RZ |
| PCB changed | 324 |
| ADC Channels | 8/8 |
| Availability | No Stock Available |
| No. of Timers | 2 |
| Package Width | 15 |
| Interface Type | CAN/I2C/SPI/UART/USB |
| Number of ADCs | 2 |
| Number of I/Os | 160 |
| Package Height | 1.25(Max) |
| Package Length | 15 |
| Programmability | No |
| Supplier Package | LFBGA |
| Core Architecture | ARM |
| ADC Resolution (bit) | 12/12 |
| Data Bus Width (bit) | 32 |
| Standard Package Name | BGA |
| Maximum CPU Frequency (MHz) | 500|125 |
| Instruction Set Architecture | RISC |
| Maximum Clock Frequency (MHz) | 500/125 |
| Maximum Operating Temperature (°C) | 110 |
| Minimum Operating Temperature (°C) | -40 |
| Maximum Operating Supply Voltage (V) | 3.6 |
| Minimum Operating Supply Voltage (V) | 3 |
| Typical Operating Supply Voltage (V) | 3.3 |
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Packaging Process
