Integrated Device Technology PS2506L-1-F3-A
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| Attribute | Value |
|---|---|
| PPAP | No |
| EU RoHS | Compliant |
| Mounting | Surface Mount |
| ECCN (US) | EAR99 |
| Packaging | Tape and Reel |
| Pin Count | 4 |
| Standards | UL |
| Automotive | No |
| Input Type | AC |
| Lead Shape | Gull-wing |
| Output Type | DC |
| PCB changed | 4 |
| Availability | No Stock Available |
| Output Device | Darlington |
| Package Width | 6.5 |
| Package Height | 3.5 |
| Package Length | 4.6 |
| Supplier Package | PDIP SMD |
| Standard Package Name | DIP |
| Typical Fall Time (us) | 100 |
| Typical Rise Time (us) | 100 |
| Maximum Forward Voltage (V) | 1.4 |
| Number of Channels per Chip | 1 |
| Typical Forward Voltage (V) | 1.17 |
| Maximum Forward Current (mA) | 80 |
| Maximum Collector Current (mA) | 200 |
| Maximum Power Dissipation (mW) | 200 |
| Minimum Isolation Voltage (Vrms) | 5000(Max) |
| Maximum Current Transfer Ratio (%) | 2000(Typ) |
| Minimum Current Transfer Ratio (%) | 200 |
| Maximum Operating Temperature (°C) | 100 |
| Minimum Operating Temperature (°C) | -55 |
| Maximum Collector-Emitter Voltage (V) | 40 |
| Current Transfer Ratio Test Current (mA) | 1 |
| Maximum Collector-Emitter Saturation Voltage (mV) | 1000 |
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Packaging Process
