10-13 NOV 2026 · Munich, Germany

MEET FIXCHIPS (C3-161) AT electronica 2026

Integrated Device Technology PS2501-1-A

Integrated Device Technology PS2501-1-A electronic component product image

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Manufacturer No
PS2501-1-A
Date Code
24+
Quantity
3,268
Availability
In Stock
Package
PDIP
Packaging
Tray
Description
Optocoupler DC-IN 1-CH Transistor DC-OUT 4-Pin PDIP Tray
Datasheet
Payment
PayPalEast West BankVISAMastercardWestern Union
Delivery
DHLFedExUPSTNT
AS9120
ISO 13485
ERAI Member
VDE
ISO 9001
ISO 14001
Five-Star After-Sales Service Certification
Bavarian Chips Alliance
UKAS Management Systems
ANAB ISO/IEC 17021
IAF
HTS
8541.40.80.00
PPAP
No
EU RoHS
Compliant
Mounting
Through Hole
ECCN (US)
EAR99
Packaging
Tray
Pin Count
4
Standards
UL
Automotive
No
Input Type
DC
Lead Shape
Through Hole
Output Type
DC
PCB changed
4
Availability
No Stock Available
Output Device
Transistor
Package Width
6.5
Package Height
3.5
Package Length
4.6
Supplier Package
PDIP
Standard Package Name
DIP
Typical Fall Time (us)
5
Typical Rise Time (us)
3
Maximum Forward Voltage (V)
1.4
Maximum Reverse Voltage (V)
6
Number of Channels per Chip
1
Typical Forward Voltage (V)
1.17
Maximum Forward Current (mA)
80/ch
Maximum Collector Current (mA)
50/ch
Maximum Power Dissipation (mW)
150/ch
Minimum Isolation Voltage (Vrms)
5000(Max)
Maximum Current Transfer Ratio (%)
600
Minimum Current Transfer Ratio (%)
80
Maximum Operating Temperature (°C)
100
Minimum Operating Temperature (°C)
-55
Maximum Collector-Emitter Voltage (V)
80
Current Transfer Ratio Test Current (mA)
5
Maximum Collector-Emitter Saturation Voltage (mV)
300
AttributeValue
HTS8541.40.80.00
PPAPNo
EU RoHSCompliant
MountingThrough Hole
ECCN (US)EAR99
PackagingTray
Pin Count4
StandardsUL
AutomotiveNo
Input TypeDC
Lead ShapeThrough Hole
Output TypeDC
PCB changed4
AvailabilityNo Stock Available
Output DeviceTransistor
Package Width6.5
Package Height3.5
Package Length4.6
Supplier PackagePDIP
Standard Package NameDIP
Typical Fall Time (us)5
Typical Rise Time (us)3
Maximum Forward Voltage (V)1.4
Maximum Reverse Voltage (V)6
Number of Channels per Chip1
Typical Forward Voltage (V)1.17
Maximum Forward Current (mA)80/ch
Maximum Collector Current (mA)50/ch
Maximum Power Dissipation (mW)150/ch
Minimum Isolation Voltage (Vrms)5000(Max)
Maximum Current Transfer Ratio (%)600
Minimum Current Transfer Ratio (%)80
Maximum Operating Temperature (°C)100
Minimum Operating Temperature (°C)-55
Maximum Collector-Emitter Voltage (V)80
Current Transfer Ratio Test Current (mA)5
Maximum Collector-Emitter Saturation Voltage (mV)300

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